i4F Be-Lite® SPC technology | i4F Patents & Technologies
i4F Be-Lite® is a patented, breakthrough technology delivering a more sustainable SPC (Stone Polymer Composite) panel production process to the global flooring industry. It reduces costs and saves CO2 at every stage of the journey, from factory to installation. A return on investment can be earned in just 2 weeks! i4F Be-Lite enables a significant reduction—up to 20%—in the use of core SPC raw materials during the manufacturing process of decorative panels, without compromising performance. Since SPC panels produced with i4F Be-Lite are considerably lighter, manufacturing and transportation costs are substantially reduced. This significantly improves the flooring industry’s carbon footprint, while remaining cost-effective for manufacturers.
Ultimately, this technology represents a meaningful difference and a win-win for both the industry and the planet.
i4F Be-Lite is a thermoforming technology that, depending on the panel's core thickness and the selected i4F Be-Lite shape (honeycomb or waffle-shaped), uses up to 20% less raw material during the panel core manufacturing process. This approach differs from other existing material-saving techniques, which remove and recycle materials post-production, leading to increased waste, costs, and CO2 emissions due to transport and recycling of scrap.
The key component of the Be-Lite® technology is a textured roller featuring protrusions, which imprint on the back of a panel on a regular SPC extrusion line. The texture does not extend to the edges of the panel, ensuring that locking strength is not compromised while reducing the total weight per square meter of the product. The resulting lighter SPC panels maintain optimum performance and reduce at least 5% of a panel's total manufacturing raw material costs, as well as decreasing transport costs by at least 6%.
Die Eigenschaften
Manufacturers benefit from reduced material waste and costs. They also decrease their carbon footprint, as no extra energy is required to produce these lighter panels, which are also less expensive to transport.
Distributors and retailers can save at least 6% on shipping costs, as fewer containers are needed to ship the same amount of panels. This also contributes to a reduction in their carbon footprint.
Installers will appreciate the energy savings and reduced physical strain. Lighter SPC panels are more comfortable to install and transport, making their work easier and less taxing.
Consumers enjoy all the advantages of rigid, resilient flooring while contributing to a reduced environmental impact. This approach provides an eco-friendlier flooring option without compromising quality or durability.
i4F Be-Lite is a thermoforming technology that, depending on the core thickness of the panels and the selected i4F Be-Lite shape (honeycomb or waffle-shaped), uses up to 20% less raw material during the panel core manufacturing process. This approach contrasts with other existing material-saving techniques that involve removing and recycling materials post-production, which leads to increased waste, costs, and CO2 emissions related to transport and recycling of scrap.
The key component of the Be-Lite® technology is a textured roller featuring protrusions, which are imprinted onto the back of a panel in a standard SPC extrusion line. The texture does not extend to the edges of the panel, ensuring that the locking strength remains intact while reducing the total weight per square meter of the product. The resulting lighter SPC panels maintain optimal performance and significantly reduce the raw material costs of manufacturing by at least 5%, as well as decrease transport costs by a minimum of 6%.
i4F Patents & Technologies | Halle 20 | Stand B38
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